EU RoHS |
Compliant |
ECCN (US) |
EAR99 |
Part Status |
Active |
Automotive |
No |
PPAP |
No |
Product Category |
Small Signal |
Configuration |
Single |
Channel Mode |
Enhancement |
Channel Type |
N |
Number of Elements per Chip |
1 |
Maximum Drain Source Voltage (V) |
60 |
Maximum Gate Source Voltage (V) |
±20 |
Maximum Gate Threshold Voltage (V) |
1 |
Operating Junction Temperature (°C) |
-55 to 150 |
Maximum Continuous Drain Current (A) |
0.38 |
Maximum Gate Source Leakage Current (nA) |
10000 |
Maximum IDSS (uA) |
1 |
Maximum Drain Source Resistance (MOhm) |
2000@4.5V |
Typical Gate Charge @ Vgs (nC) |
0.5@4.5V |
Typical Gate to Drain Charge (nC) |
0.09 |
Typical Gate to Source Charge (nC) |
0.09 |
Typical Input Capacitance @ Vds (pF) |
32@30V |
Typical Reverse Transfer Capacitance @ Vds (pF) |
2.4@30V |
Minimum Gate Threshold Voltage (V) |
0.5 |
Typical Output Capacitance (pF) |
3.9 |
Maximum Power Dissipation (mW) |
590 |
Typical Fall Time (ns) |
12.5 |
Typical Rise Time (ns) |
2.5 |
Typical Turn-Off Delay Time (ns) |
22.6 |
Typical Turn-On Delay Time (ns) |
2.4 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
150 |
Supplier Temperature Grade |
Automotive |
Packaging |
Tape and Reel |
Maximum Power Dissipation on PCB @ TC=25°C (W) |
0.59 |
Maximum Pulsed Drain Current @ TC=25°C (A) |
1.2 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) |
338 |
Typical Diode Forward Voltage (V) |
0.8 |
Typical Gate Plateau Voltage (V) |
1.8 |
Maximum Diode Forward Voltage (V) |
1.3 |
Maximum Positive Gate Source Voltage (V) |
20 |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) |
0.38 |
Supplier Package |
SOT-23 |
Pin Count |
3 |
Standard Package Name |
SOT |
Mounting |
Surface Mount |
Package Height |
0.98 |
Package Length |
2.9 |
Package Width |
1.3 |
PCB changed |
3 |
Lead Shape |
Gull-wing |